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Grinding Solutions DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently.

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Grinding Solutions DISCO Corporation

Ultra-Thin Grinding. In recent years, the demand for ultra-thin die for use in mobile phones, stacked packages, and a myriad of other applications has been increasing. DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. TAIKO Process.

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共通 DISCO Corporation

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers, and DISCO corporate information is also

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DISCO precision machines - dicing-grinding service

Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality. Consumables like tapes, dicing blades and grinding wheels complete our full

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Dicing and Grinding Service Solutions DISCO Corporation

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.

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Dicing and Grinding Using the ... - Disco Corporation

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

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Product Information DISCO Corporation

Product Information DISCO Corporation. Product Information. DFD6240. Dicing Saw. Fully Automatic. Φ200 mm. Single spindle. Product Information. DFD6340.

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Thinning by Grinding Wheel (Grinding) DISCO Technology ...

Grinding is a process for making board-shaped workpieces thin (approx. less than 1 mm thick) and flat by using a grinding wheel. The grinding wheel is an abrasive which uses synthetic diamond. Wheel segments (thickness: several millimeters, height: 3 – 5 mm) are

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DISCO grinding and polishing machines and abrasive ...

DISCO grinding and polishing machines and abrasive equipment - dicing-grinding service.

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Disco Back Grinding Machines Products Suppliers ...

New Norton Stellar inserted-nut grinding wheels for double and single disc grinding last 30% longer than other disc grinding products, resulting in increased parts per wheel and a lower cost per part. Manufactured to provide an excellent finish throughout the life of the wheel, Norton Stellar grinding...

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DISCO precision machines - dicing-grinding service

Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

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Thinning by Grinding Wheel (Grinding) DISCO Technology ...

Overview of Thinning by Grinding Wheel. Grinding is a process for making board-shaped workpieces thin (approx. less than 1 mm thick) and flat by using a grinding wheel. The grinding wheel is an abrasive which uses synthetic diamond. Wheel segments (thickness: several millimeters, height: 3 – 5 mm) are arranged along a ring-shaped wheel base.

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Dicing and Grinding Using the ... - Disco Corporation

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

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DFG8540 Grinders Product Information DISCO Corporation

The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by

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2020 News DISCO Corporation

DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed two types of fully automatic grinders that support diversified package grinding needs.

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DISCO grinding and polishing machines and abrasive ...

DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

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Disco Back Grinding Machines Products Suppliers ...

Insaco, Inc. Lens Grinding Polishing Specialized Lens Generating and Polishing Equipment allows Insaco to Manufacture a wide variety of Lens in Sapphire and other Optical Materials. Since 1947 Insaco has been a precision machining and polishing fabricator of parts from all technical ceramics, sapphire, glass and quartz. We machine these materials to very precise tolerances (many times ...

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Accessory Equipment - DISCO Corporation

Workpiece charging significantly reduced. The CO 2 Injector lowers the resistivity of purified water by dissolving carbon dioxide gas into the dicing cutting water. Once the user-set resistivity is reached, the CO 2 Injector maintains this level with a high degree of accuracy. By lowering the degree of static charge the workpiece acquires during cutting, the CO 2 Injector helps prevent ...

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Dicing-Grinding Service by DISCO - dicing-grinding service

Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.

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DISCO Corporation history and figures - dicing-grinding ...

By rapidly adapting to market needs and delivering on-demand technologies, DISCO Corporation has established itself as a market leader in dicing (Kiru), grinding (Kezuru) and polishing (Migaku) technologies. Today, DISCO Corporation has over 50 affiliates in 16 countries worldwide. The DISCO Headquarter is located in Omori, Tokyo.

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DISCO dicing saws and quality equipment - dicing-grinding ...

DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

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Disco Corporation Production Equipment Japan

Company profile for solar equipment manufacturer Disco Corporation - showing the company's contact details and products manufactured. ... Disco Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 +81 3 45901111: disco.co.jp ... Wafer Grinding Equipment, Wafer Polishing Machine Last Update 10 Apr 2020 ...

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Equipment Recycling Service Support DISCO Corporation

DISCO Corporation, to further its industry leadership in the 3R's (reduce, reuse, recycle), has received qualification from the Ministry of the Environment as a Nationwide Recycler of Designated Industrial Refuse and will begin the collection and recycling of its used machines—a first in the production machinery industry.

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High-Quality Grinding of Lithium Tantalate - DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to

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DFG8540 Grinders Product Information DISCO Corporation

The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. Inherited grinding specifications with an established reputation. DFG8540 is the successor to the DFG800 series, equipment used by

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High-Quality Grinding of Lithium Tantalate - DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to

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Disco Corporation Production Equipment Japan

Company profile for solar equipment manufacturer Disco Corporation - showing the company's contact details and products manufactured. ... Disco Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 +81 3 45901111: disco.co.jp ... Wafer Grinding Equipment, Wafer Polishing Machine Last Update 10 Apr 2020 ...

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DISCO Corporation Company Profile - Office Locations ...

Apr 06, 2021  Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

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Dicing and Grinding Service - DISCO Corporation

Dicing and Grinding Service It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at

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Used Disco Corporation Equipment Buy Sell EquipNet

Disco Corporation is a manufacturer typically found in the Semiconductor Industry, focusing on precision tooling. Headquartered in Tokyo, the Japanese manufacturer is most known for making dicing saws and wafer grinders, used for manufacturing semiconductor wafers.

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Accessory Equipment - DISCO Corporation

Workpiece charging significantly reduced. The CO 2 Injector lowers the resistivity of purified water by dissolving carbon dioxide gas into the dicing cutting water. Once the user-set resistivity is reached, the CO 2 Injector maintains this level with a high degree of accuracy. By lowering the degree of static charge the workpiece acquires during cutting, the CO 2 Injector helps prevent ...

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DISCO dicing saws and quality equipment - dicing-grinding ...

DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

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Others Solutions DISCO Corporation

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. ... Surface planners use bit grinding with a diamond bit to realize high-accuracy planarization for ductile materials (Au, Cu, and solder), resin (photoresist, polyimide), and ...

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DISCO Corporation history and figures - dicing-grinding ...

By rapidly adapting to market needs and delivering on-demand technologies, DISCO Corporation has established itself as a market leader in dicing (Kiru), grinding (Kezuru) and polishing (Migaku) technologies. Today, DISCO Corporation has over 50 affiliates in 16 countries worldwide. The DISCO Headquarter is located in Omori, Tokyo.

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Task 1. Case Disco Corporation.docx - RISEBA 2018 Name ...

For example, Tokyo-based Disco Corporation claimed up to an 80 per cent world market share and up to a 90 per cent Japanese market share in some years for high- precision equipment for cutting and grinding silicon wafers into semiconductors. Disco’s systems are used by most of the world’s semiconductor manufacturers. This is a highly ...

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DTU162 Accessory Equipment Product Information DISCO ...

DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Read this section first How to

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Laser Lift-off (LLO) DISCO Technology Advancing the ...

With the Laser Lift-Off (LLO) processing technology, the inside of the processing material is irradiated with a high-power laser, heated, and decomposed in a planar orientation. Then, the processing material is separated from the processed area which serves as the base point for detachment. DISCO uses a diode pumped solid state (DPSS) laser for the LLO process, which realizes much less ...

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Disco Corporation - Wikipedia

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...

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